The CuPRAplus from Kulicke & Soffa Industries supports highly consistent and stable fine wire 2nd bonds, while maintaining the quality of the overall wire bonding process. By ensuring both 1st and 2nd bond quality during fine copper wire bonding, the copper capillary offers a more stable mass production process. The copper capillary works together with the company’s iCu Copper wire and bonder kit to provide a complete solution for manufacturers looking to take advantage of the cost advantages offered by copper wire. While the firm’s original CuPRA capillary offered a bonding performance comparable to gold bonds on various pad materials, the new product takes fine copper wire bonding a step forward by ensuring both a quality 1st and 2nd bond for good process control and productivity. Available in a range of wire diameters to address different wire bonding challenges, the product can handle copper wire from 0.8 mil to 3.0 thicknesses. It is easy to implement on any existing bonding platform.
EPP Europe 429
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