With the X410 PDR has developed a BGA and SMT rework system based on Focused IR technology that delivers high-end, precision results in a simple to use process. It has been designed to meet the challenges of repairing today’s high-end circuit board assemblies. The rework station is a tool-free, gas-free system based on the company’s patented Focused IR technology offering instant and precise control over the entire rework process. The unit provides high levels of profiling and process control for effective rework of the most advanced packages, such as SMDs, BGAs, CSPs and flip-chips, as well as 0201 and lead-free applications. It delivers 150 W of precision component heating using lens-based infrared technology, which is ideal for reworking BGAs and other hidden joint devices, because the heat is delivered to the joints in a safe and gentle way with no effect on any adjacent packages.
The system’s high quality mechanics, optics and control allow an operator to quickly and easily pick up a BGA from the nest, align it and place it onto fluxed pads. It can then be reflowed via the system’s accurate PC-based, closed-loop component and board temperature controls. Boards up to 420 x 500 mm (17” x 20”) are held securely on a macro-micro X/Y table. The table features micrometer control providing ±10 microns movement in the X and Y directions and has a macro override facility. The system delivers Focused IR component heating through an adjustable lens attachment. Its standard F700 attachment creates heating spot sizes from 25 mm to 70 mm (0.98” x 2.7”) in diameter, but there are three optional attachments available for spot sizes down to 4 mm. Underside heating is provided by two, switchable, 600 W medium wave infrared sources that make up two zones: a inner 120 mm x 300 mm (4.72” x 11.81”) and a combined 240 mm x 300 mm (9.45” x 11.81”). A vacuum operated precision component placement system delivers precise macro-micro Z-axis movement. It has micrometer control for soft component landings and allows the device to be rotated through a full 360 °. A component nest and print frame facility is also included for applying solder paste. A manually adjustable, K-type, non-contact IR sensor measures the component’s temperature in real-time throughout the process, while board temperatures are measured throughout using a manually attached K-type sensor. The entire rework process runs under PC control using ThermoActive V3 Software Suite. This package includes many functions, such as real-time, closed-loop component and board temperature control, drag and drop profile setting, temperature profiling and data logging. An optional prism-based BGA/Micro-BGA alignment system is also available, featuring split beam simultaneous alignment of the board and component. Its integral LED lighting offers controllable illumination levels and a CCTV camera supplies colour images to a 15-inch TFT/LCD flat-screen monitor.
EPP Europe 431
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