Datacon has introduced its adhesive tape feeder & cutter for the 2200 evo. The 2200 evo signifies a revolution in Multi-chip die bonding. The new bonder generation was developed on the basis of the proven 2200 platform and represents a milestone in the field of advanced packaging. Thanks to a dispenser and bonding system which works in parallel in a single module with up to 7,000 CPH, the multi-chip die bonder offers highest throughput on a footprint of just 116 x 122 cm. The dispenser is not mandatory but can easily be retrofitted if required later, as can a second dispense unit. The highly flexible equipment can process up to 25 different 300 mm wafers in single pass. 14 different pick-up tools and 5 different ejection tools are additionally available in one module.
Of course the multi-chip die bonder is not just intended for die attach, but is also a fully-fledged flip-chip bonder. Further features include the heatable bonding tool, for example for stacked-die applications, and the broad handling range from 250 µm small up to 50 mm large dies. This enables production, for instance of SiPs (System in a Package), with all kinds of active and passive components in a single pass. This significantly increases not only the throughput but also in particular the yield. The tried-and-tested, modular concept has also been retained in the multi-chip die bonder. For very high production volumes, several Multi-chip die bonders can be linked up to work in parallel. To provide even more flexibility, an adhesive tape feeder & cutter can be integrated at the additional dispense axis, offering the parallel processing of film application and die placement in one module. While the ID axis places the film on the substrate, the main axis bonds the die on the prior ready-made bond positions. This results in considerable throughput increase! Flip chip is still possible without the need to change any configuration. An optionally available heated bond base and bond head will serve for good process results. Due to the high flexibility of the multi-chip die bonder, the adhesive tape feeder & cutter can also be integrated at the main axis for single-pass production of thin dies or wet-in-wet stack dies. No matter what the demands are for high performance stacked die equipment: The multi-chip die bonder combined with the integrated adhesive tape feeder & cutter provides a top team with plenty of opportunities for highest performance resulting in optimum production output and lowest cost of ownership.
Manfred Glantschnig, Product Manager for the 2200 platform at Datacon, sums up: “With a precision of 10 µm @ 3 s and a throughput of up to 7,000 CPH, the 2200 evo sets new standards as a Multi-chip die bonder, especially in SiP production. The highest throughput, thanks to parallel processing, combined with the lowest cost of ownership will soon make our 2200 evo the equipment of choice in the advanced-packaging market. The optional adhesive tape feeder & cutter makes it a perfect equipment for any Multi-chip and stacked die application you can imagine.”
EPP Europe 426
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