Apollo Seiko, a leader in soldering technology, will showcase its latest advancements at Booth 1408 during the 2024 IPC Apex Expo, taking place 9th-11th April...
Tag - Heat sinks in electronics manufacturing
Heat sinks are essential components in electronic devices, dissipating heat generated by electronic components to maintain optimal operating temperatures. These passive thermal management solutions come in various shapes and sizes, often made of materials like aluminum or copper, and are widely used in computers, smartphones, LED lights, and other electronics to prevent overheating and ensure reliability and longevity.
Skived fins are one method used by cooling solutions provider CTX Thermal Solutions to ensure high specific power density in heat sinks. A new skiving machine...
Provider of materials and matched material solutions for electronics packaging, Heraeus Electronics, has announced it is one of five partners in the three-year...
Supplier of custom cooling solutions CTX Thermal Solutions has introduced extruded and cold extruded aluminum SMD heat sinks designed and produced for the...
Manufacturer of tailor-made cooling solutions for electronic components CTX Thermal Solutions says it offers extruded profile heat sinks with a diverse array...
Dow introduced the Dowsil TC-3065 thermal gel, a one-part, thermally conductive gel developed to dissipate high amounts of heat away from sensitive electronic...
The Elecolit 6607 adhesive from Panacol is thermally conductive and can be oven cured at temperatures as low as 80 °C. It is characterised by excellent...
Electrolube has launched a range of thermal gap fillers that provide a highly effective heat transfer solution for many different applications. The new gap...
High-quality systems for automatic optical inspection (AOI) of electronic assemblies offer as standard features both high throughput and 3D. For hidden solder...
The Zollner Elektronik AG is the only German company listed among the top 15 EMS manufacturers worldwide. The services offered a range from development of...
