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CyberOptics Features New Dual-Mode MRS Sensor at Smart SMT & PCB Assembly in Korea

Smart SMT & PCB Assembly
CyberOptics Features New Dual-Mode MRS Sensor at Smart SMT & PCB Assembly in Korea

SE3000 Cyberoptics
New Dual-Mode MRS Sensor Source: CyberOptics

CyberOptics Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high-precision 3D sensing technology solutions will feature the SQ3000 Multi-Function system for AOI, SPI and CMM and the SQ3000+ powered by Multi-Reflection Suppression (MRS) technology at the Smart SMT & PCB Assembly Show in booth #I132 , scheduled to take place April 6-8, 2022 at the Suwon Convention Center in Suwon, South Korea. The company also will highlight the SE3000 with the new dual-mode MRS sensor.

The SE3000 SPI System incorporates the new Dual-Mode MRS sensor for superior performance and maximum flexibility for dedicated solder paste inspection applications, with one mode for high-speed, and another mode for high resolution. The new sensor is an extension of the proprietary sensor portfolio that provides industry-leading performance in semiconductor and SMT markets. Customers value the high accuracy, repeatability and reproducibility of the SE3000 that is ideal for detecting insufficient or excessive paste, height, area and other SPI applications.

“For dedicated SPI applications, we have integrated our new Dual-Mode MRS sensor into the SE3000 system to provide superior performance and flexibility,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “With this addition to our portfolio of systems, customers have another option that can significantly improve their yields, processes and productivity.”

The SQ3000+ Multi-Function system powered by MRS for inspection and metrology is an extension of the multi-award-winning SQ3000 platform deemed best-in-class, that not only conducts AOI and SPI, but uniquely delivers in-line, full coordinate measurement (CMM) data in seconds, not hours.

CyberOptics’ unique MRS sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together, delivering metrology grade accuracy at production speed. Effective suppression of multiple reflections from shiny components and surfaces is critical for highly accurate inspection and metrology, making it an ideal technology solution for a wide range of applications with high quality requirements.


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