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Applications

Improving the process of bonding with use of stand-off stitch
Ultra high-reliability wire bonding

High-reliability wire bonding has historically required the addition of a security bond over the stitch—or second bond—of each ball bonded wire. While this...

3D X-Ray Inspection of double-sided equipped PCBs
Quality check of electronic assemblies

More rapid, more compact, more complex– daily routine in a modern electronics production. The demands on electronic systems’ performance with parallel...

All in one: Fast printer verification and easy process optimization
3-D SPI with Process Uplink

Smyczek GmbH & Co. KG is a manufacturer of high-quality components and devices. Customers bring product ideas to Smyczek and the company manages the...

Conformal coating process characterization considerations
Protected electronics assembly

Conformal coating is an enabling process that allows for the ruggedizing of electronic devices and modules. As the process increases the durability of...

New concepts for maximum flexibility from a single source
Increase productivity and save on operating costs

Due to decreasing batch sizes and increasing product switching, the electronics industry needs greater flexibility in production. SMD lines must be set up for...

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2024
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