Datacon has added Laurier’s ultra high precision flip chip die bonder to its portfolio. Designed to meet the needs of high accuracy bonding applications and...
Applications
Humiseal UV40 is a range of UV conformal coating materials. Humiseal UV40 is easy to process and wont “crack” under thermal cycling, offering manufacturers...
LFM-48 TM HP Pb-free solder is a generation tin-copper-silver alloy formulation exhibiting good wetting, high definition printing with long screen and tack...
Hitachi High-Technologies’ modular direct-drive mounter GXH-1S with 4 gantries supplies maximized throughput for rates of up to 80,000 parts/hour – capable...
Ultrasonic stencil cleaners require the stencil to be immersed vertically into tall tanks from above the machine. Large 750mm stencils are placed in heavy...