Alle Meldungen, Produkte und Entwicklungen rund um Universal Instruments.
36 Meldungen
Universal Instruments Corporation has announced its Electronics Packaging Symposium, scheduled for September 9–10, 2026, in Binghamton, New York.
Universal Instruments Corporation has announced the ISIG Executive Summit SEA, set to take place on 27–28 October 2026 in Penang, Malaysia, bringing together senior decision-makers from the Southeast Asian electronics…
Universal Instruments expands its Genesis Platform portfolio with the introduction of the GenesisSC Platform – a Semiconductor solution that blends
Universal Instruments has expanded the capabilities of its Genesis platform offering by augmenting the successful dual-gantry (D-Series) configuration
Universal Instruments has appointed Greg Benoit as Product Manager for software products. He will be charged with responsibility for all software products
Universal Instruments Advanced Semiconductor Assembly Division, Odd Form Assembly Division and SMT Laboratory were merged with Hover-Davis Direct Products
Universal Instruments Corporation has announced that it is leaving the portfolio of technology businesses held by its current parent company, Dover
Universal Instruments has used Semicon West to demonstrate its latest platform placement system, the AdVantis XS. Designed specifically for the
As the new president of Universal Instruments Jeroen L. Schmits has over 15 years experience in the electronics manufacturing industry. EPP Europe has
The well-known industry executive Jeroen L. Schmits, president of Vitronics Soltec since 1999, has moved from this position to assume the recently vacated
Universal Instruments’ placement platform AdVantis XS is designed specifically for the convergence of semiconductor and surface-mount assembly, deploying
Universal Instruments has introduced software to enhance new product introduction (NPI) for its customers. The utility enables easier and faster error
The expertise of Universal Instruments’ SMT laboratory is now available on factory floors worldwide. The ability to quickly optimize processes for
Universal Instruments has added an on-line wafer expander option to its wafer feeder system for semiconductor assembly. The expander will be especially
Universal Instruments has celebrated 15 years of its OEM agreement with Hitachi High Technologies (HHT) to market the 4797 HSP high-speed, turret-style
Universal Instruments' Quadris placement machine is a quad-beam solution that complements the portfolio consisting of the dual-beam Genesis and
Universal Instruments has extended the scope of its Optima Plus line solutions to deliver limitless configuration choice, equipment capabilities and
Universal Instruments’ president Ian McEvoy (before with sister company DEK) has left to pursue new opportunities. Ian deSouza, before senior vice
Universal Instruments' high-speed Lightning placement head extends the performance of its Genesis and AdVantis platform systems. The placement head
Following global restructuring, the launch of product ranges, technical innovations and improved supply-chain management, Universal Instruments has now
Universal Instruments has trimmed the footprint and increased the maximum board size for its high-speed placement platform4797R HSP, to provide more
With a number of initiatives, Universal Instruments obviously shows that its commitment to its global customer base is as strong as it was before the
Universal Instruments (UIC) is to provide SMD placement capabilities at Heraeus service centers in Hanau/Germany and Suzhou/China and to train the
Universal Instruments’ Polaris Jr. is focused on the lower end of robotic and non-robotic assembly processes. Building upon the servo gripper for odd-form
Even now, more than two decades after surface-mount technology (SMT) entered the board assembly arena, the world wide total market for insertion machines
Universal Instruments is now offering its AdVantis platform at a special introductory price of E 110,000. It is designed for medium volume, flexible
Universal Instruments has appointed key-management roles. Brad Bennett, director GSM platform products in Binghamton/NY, is moving from the HQs to Europe
Universal Instruments has appointed Bob Lamanna to director of global services, reporting directly to Gene Heiser, VP of corporate sales. His main
Universal Instruments is implementing a global cost reduction initiative considered to set the next pricing standards in the SMT assembly industry. This
The GSM placement platform of Universal Instruments reportedly delivers significant improvements in yield, reliability, throughput and ease of use. It is