At the same time, the advanced materials engineering and optimized design of the AdVantis platform offers customers a highly competitive price some 25 % lower than its predecessor, while the company’s platform philosophy ensures high levels of backward compatibility, shared resources and common interfaces – even extending to the GSM Genesis platform range. “Overall, our studies demonstrate that AdVantis XS can cut cost of ownership by 40 % which, in turn, reduces cost-per-placement in the competitive flip chip market segment,” claims Richard Boulanger, Vice President of the Advanced Semiconductor Assembly division.
“Leveraging Universal’s credentials as a pioneer of leading-edge placement platforms, the high accuracy AdVantis XS extends equipment capabilities into System-In-Package (SiP) assembly,” Boulanger said. “The state of the art handling, vision, and placement technology of the AdVantis XS allows manufacturers to perform challenging flip chip processes, process bare dies, and assemble complex optoelectronic components.”
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