Universal Instruments Corporation has announced its Electronics Packaging Symposium, taking place September 9–10, 2026, in Binghamton, NY. The event is hosted by the equipment and process solutions provider at its headquarters location, which serves as a technical development centre for advanced assembly and packaging technologies.
Universal Instruments regularly uses the symposium format to address process and materials challenges in electronics assembly, including semiconductor packaging, advanced interconnect technologies, and SMT process development — topics directly relevant to European EMS providers and OEMs sourcing equipment and process expertise from North American suppliers. Further programme details have not yet been disclosed.
Quelle: Universal Instruments – https://www.uic.com/electronics-packaging-symposium/
