Alle Meldungen, Produkte und Entwicklungen rund um Kulicke & Soffa.
14 Meldungen
SEMI has recognised Kulicke & Soffa with the 2026 SEMI Award for North America, citing the company's fluxless thermocompression bonding technology based on formic acid in situ oxide reduction as a key enabler for…
Kulicke & Soffa Expands Thermal Compression Bonding Capabilities to Accelerate Innovation in the Integration of Semiconductor and Silicon Photonics.
UK distributor of technical equipment and materials Inseto, has announced that it has supplied two Kulicke & Soffa RAPID Pro automatic wire bonders to
Computrol, Inc. announced that it has invested in another Kulicke & Soffa Assembléon AX-501 pick-and-place system.
Kulicke and Soffa Industries, Inc. announced it has finalized the transaction to acquire a 100% equity stake of privately held Assembléon B.V., based in
Microelectronics assembly specialist Inseto will assume all sales and technical support for Kulicke & Soffa’s Orthodyne wedge bonder products in the
Kulicke & Soffa Industries has introduced two die bonders. Engineered for greater productivity and performance, the Easyline E8202 offers greater
The new gold wire from Kulicke & Soffa Industries is designed for all types of stacked-die and multi-tier applications. It offers highly accurate and
The manual wire bonder (Model 4700) from Kulicke & Soffa offers ball-wedge and wedge-wedge bonding capabilities on one machine configuration. This
Effective at May 1, 2006, Kulicke & Soffa Industries has relocated its corporate headquarters to a new building in Fort Washington, Pennsylvania. The
The Kulicke & Soffa AW-66 4-N ball-bonding wire reportedly provides superior reliability, being one of the highest reliable wires by robustness in all
Kulicke & Soffa’s Maxµmplus ultra-high speed ball bonder is for all types of ultra-fine pitch applications including 35 micron in-line pitch.
Datacon and Kulicke & Soffa (K&S) are in the process of reorientation in their long-standing partnership. Beginning middle of this year, K&S
Kulicke & Soffa is introduc-ing the WaferPRO, a large-area stud bumper that offers 300mm capability, combining single-pass processing with the high