Based on Alphasem’s Easyline platform, both die bonders feature state-of-the-art technologies such as a high-speed, air bearing pick-and-place system, fully automatic wafer handling system and a closed-loop linear motor pick tool that ensures bond line thickness control and a non-piercing pick process. Offering improved speed and throughput with accuracy of ± 38 µm, the Easyline E8202 die bonder is up to 30 % faster than its predecessor – the E8032.
Capable of ± 25 µm placement accuracy, the Easyline E8202P also provides greater precision with accuracy improved from ± 38 µm to ± 25 µm. Both machines also incorporate maintenance-free air bearing technology for uptime higher than 97 % in addition to top throughput per floor space with up to 11,500 cycles per hour. Simplified set-up with a graphical user interface in English and Chinese and fast product changeover typically within five minutes emphasize the die bonders ease of use.
Christian Rheault, K&S Vice President, Equipment Segment states, “We’ve moved quickly with our Alphasem Engineering staff in bringing newer die attach technology to the marketplace. The new Easyline E8202 and E8202P represent the first step in launching more accurate and faster die bonders. Our customers can look forward to a totally new generation products to come from us over the next year.”
EPP Europe 428
