Productronica-2017
Production systems and die bonding under vacuum
22. Januar 2018Finetech presented new product highlights for advanced packaging and SMD rework, including die bonding under vacuum, attracting visitors at productronica.
Alle Meldungen, Produkte und Entwicklungen rund um Finetech.
14 Meldungen
Finetech presented new product highlights for advanced packaging and SMD rework, including die bonding under vacuum, attracting visitors at productronica.
Finetech introduces the new Fineplacer Sigma bonder, designed to provide a solution for large die up to 100 mm, combined with a working area of
Finetech customers around the world have successfully reworked QFN components with the Direct Component Printing(DCP) module. Their feedback and
Thanks to its modular system architecture, the Fineplacer matrix from Finetech is an assembly and rework station capable of a wide range of applications
The effective rework system, the Fineplacer core provides an out of the box solution and is based on Finetech’s proven hot air technology, that has been
From the 1st of January 2010 Martin GmbH will be under new ownership. The founders Elke and Bernhard Martin have sold 100% of their shares to the Berlin
At the Productronica tradeshow, Finetech has introduced its upcoming entry-level rework system, the Fineplacer core. This compact rework station allows
Finetech, Berlin, will present its new brand identity at Productronica in november. The product portfolio, which includes manual and automatic
The video microscope workstation Fineview from Finetech allows for detailed inspection and analysis of small PCBs and components, that is for defect
Finetech has formed a technical partnership with Technical Product Trade (TPT) located in Wessling, Germany, in order to offer manual and semiautomatic
The Opto-Bonder Femto from Finetech is the newest bonder in the award-winning Fineplacer family, capable of handling various assembly technologies,
The Pico is Finetech's most versatile base module, and can be used in a wide field of applications for rework and different kinds of micro assembly such
The Finetech mobile device-rework pack with integrated solder-paste dispenser (MDR) has been developed for the demand of mobile phones, PDAs, handhelds,
The Finetech module Sonic Void Reducer supports the wire-bonding or soldering process, as it allows the significant reduction of gas or air inclusions