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The flat design without solder deposit (unlike BGA, i.e.) requires an external solder application solution.
The trend is toward fine pitch QFN which calls for a highly precise and stable application of solder material.
QFN with power pads used for heat dissipation and electrical connection make particular demands to the de-soldering process, especially if the component is to be re-used.
Commonly, QFN components can be found on densely populated PCB with limited or no access at all for paste printing heads and the likes.
According to IPC/JEDEC QFN components are specified for a maximum of only three reflow cycles.
In order to protect the sensitive print layout a careful vacuum-controlled component handling is a necessity.

The flat design without solder deposit (unlike BGA, i.e.) requires an external solder application solution.
The trend is toward fine pitch QFN which calls for a highly precise and stable application of solder material.
QFN with power pads used for heat dissipation and electrical connection make particular demands to the de-soldering process, especially if the component is to be re-used.
Commonly, QFN components can be found on densely populated PCB with limited or no access at all for paste printing heads and the likes.
According to IPC/JEDEC QFN components are specified for a maximum of only three reflow cycles.
In order to protect the sensitive print layout a careful vacuum-controlled component handling is a necessity.

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