Applications
Flip chip bonder
19. September 2007With its 8800 FC Quantum series, Datacon can make its mark in the sensitive segment of flip-chip bonding of sophisticated and complex high-end components
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With its 8800 FC Quantum series, Datacon can make its mark in the sensitive segment of flip-chip bonding of sophisticated and complex high-end components
Datacon has introduced its adhesive tape feeder & cutter for the 2200 evo. The 2200 evo signifies a revolution in Multi-chip die bonding. The new
In the future, Datacon will be focusing entirely on its core business – the development and manufacture of high-precision production machines for the
Datacon has added Laurier’s ultra high precision flip chip die bonder to its portfolio. Designed to meet the needs of high accuracy bonding applications
With the merger of Besi and Datacon, a globally leading supplier of semiconductor-packaging equipment was born. How would you characterize the position
Especially for the smart-card manufacture, Datacon has developed the 8800 FC Smart Line for high throughput and precision as well as 100% inspection and
The assembly of camera modules/image sensors requires flexible equipment with a broad functional range, high precision and throughput. The Datacon 2200
Semiconductor equipment expert company Datacon has obviously recovered from recession. In spite of the over-valued euro and remarkably low business in
The balancing act between maximum speed and very high precision is reportedly not a problem for Datacon's flip-chip platform 8800 FC. The company's
Datacon, specialist firm for semiconductor die bonding and production equipment, more than doubled its European revenue in the automotive electronics
Datacon in Radfeld/Austria will implement a program of measures leading to a tighter and more efficient organization and thus reduce costs. As well as
Despite difficult times, Datacon is still supplying its modular flip-chip and MCM die-bonders to leading semiconductor subcontractors. For example,
Datacon has received first position of the VLSI Research 10 Best award in the category of assembly equipment. Its highest rated categories were product
Datacon and Kulicke & Soffa (K&S) are in the process of reorientation in their long-standing partnership. Beginning middle of this year, K&S
Datacon, supplier of semiconductor manufacturing equipment, will have a US subsidiary up and running with offices in Trevose/Philadelphia and in Phoenix.
Datacon's stackloader STL2 fits into the modular die bonder concept and can be configured with the units 2200 apm, 2200 apm+ and EWR. It has the