The dual head flip chip bonder processes the entire spectrum of bond and bump technologies for flip chip assembly. The open concept can accommodate the increasing future demands of flip chip processing and also allows for the integration of dispensing.
EPP Europe 444
AIM Solder is participating in the upcoming SMTA International 2025 event, which is taking place from October 19–23 at the Donald E. Stephens Convention
Under the motto “Assembling the Future”, Phonotronica Ltd. has been a pioneer in the development and manufacture of electronic modules since 1990.