Datacon’s stackloader STL2 fits into the modular die bonder concept and can be configured with the units 2200 apm, 2200 apm+ and EWR. It has the capability to handle BGA strips, leadframes, ceramic strips as well as FR4 substrates. Manufacturers put stringent demands on how the equipment will be integrated into assembly lines. Flexibility is a key issue, as there is a strong need in the backend for providing different advanced packaging solutions in a short time, possible only if lines are built-up of highly modular systems. The automated stackloader follows an easy operation principle, starting with placing the trays on the conveyor. This conveyer is used as a buffer for up to 6 trays, depending on the substrate size. A pickup head transports a strip out of the tray on the transport system, or the interleave material into the empty tray on the conveyor. Loading/unloading can be done in two different ways: first, in a continuousprocess where the production doesn’t have to be interrupted. Loading takes place in front of the machine, unloading of empty trays must be done in the rear. Second, in a discontinuous, batch-type way. Here, production stops if all stacks are processed, and the operator loads/ unloads the trays.
