Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/News/Artikel
    All the foundations laid for optimum business
    Foto: ThisisEngineering / Unsplash
    News

    All the foundations laid for optimum business

    Datacon, supplier of semiconductor manufacturing equipment, will have a US subsidiary up and running with offices in Trevose/Philadelphia and in Phoenix.
    Veröffentlicht
    01. Juni 2002
    Lesezeit
    2 Minuten
    Rubrik
    News

    The Austrian company is responding to the increasing demand for complex, customized packaging solutions and will thus be able to guarantee the shortest communication channels to its customers. Datacon’s strategic orientation – from equipment supplier through to provider of complete process solutions in the field of die bonding – combined with the growing complexity of production processes and the ever-decreasing product cycles of the packages demands an intensive, direct exchange of information between the manufacturer’s design departments and those of its customers. The company believes that it has to respond quickly to individual requirements with fully customized process and automation solutions. As Helmut Rutterschmidt, president and director of the board at Datacon, underlines, “Although our sales partner Kulicke & Soffa has done a fantastic job in the last three years, with our recent rapid growth we have now reached a size which not only allows us to operate independently worldwide, but also makes this a necessity if we are to utilize our dynamic strength and flexibility to the advantage of our customers.”

    The close collaborative partnership with the existing sales partner will be maintained in the form of a marketing alliance. This is reflected in the fact that both a large number of the Datacon product specialists and the experienced management of the die-bonder division at Kulicke & Soffa will transfer to Datacon’s subsidiaries in the US and Asia. These enlargements together with the acquisition of Eurotec GmbH, and the founding of a Hungarian subsidiary are regarded as an excellent starting point for becoming a leading supplier in the advanced packaging market focusing on die bonding.

    With four product divisions and a staff of 400, the group will serve the different market segments with their individual needs. Rutterschmidt seems confident in the upcoming progress of the enterprise, “We have taken on a lot. But we are well positioned and have laid all the foundations for optimum support of our customers, also in the future – in all aspects of advanced packaging, around the globe”. And his customers seem to be honoring this. Despite the undeniable slump in the industry, the company had the opportunity to negotiate some attractive orders with remarkable potential, placed in the prospective areas of telecom and automotive. (gbw)

    www.datacon.at

    Mehr aus News

    Weitere aktuelle Artikel aus der Rubrik News.

    Alle News-Artikel
    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in GermanyFoto: Laurens van der Drift / Unsplash
    News

    Microtronic Takes on Distribution of iRaptor EYE Thermal Profiler in Germany

    9. November 2026

    German distributor Microtronic has announced it will represent iRaptor LDA and its EYE thermal profiler in Germany. The Portuguese developer's system extends beyond conventional 2D time-temperature profiling by…

    Indium Corporation Presents Solder Materials Research at SMTAI 2026Foto: Indium Corporation
    News

    Indium Corporation Presents Solder Materials Research at SMTAI 2026

    29. Oktober 2026

    Indium Corporation is fielding five specialists at SMTA International 2026 to present new findings on solder paste rheology, BGA ball alloy selection for lower-temperature reflow, and the effect of print gap on paste…

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026Foto: Vishnu Mohanan / Unsplash
    News

    KYZEN to Present AQUANOX Aqueous Cleaning Chemistries at SMTA International 2026

    16. Oktober 2026

    KYZEN will exhibit its AQUANOX line of aqueous electronics cleaning chemistries at SMTA International, October 27–29, 2026, highlighting prolonged bath life as a process efficiency and cost-reduction lever for…

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT LinesFoto: Cybord
    News

    Fuji America and Cybord Partner to Integrate Visual AI Component Inspection into SMT Lines

    29. August 2026

    Fuji America Corporation and Cybord have announced a strategic partnership to embed AI-powered component analytics directly into SMT production lines, enabling 100% real-time inspection of electronic components during…

    ← Zurück zu NewsZur Startseite