IPC’s second annual Conference on Electronics Assembly: Soldering, Assembly & Inspection, held in Budapest, Hungary saw an increase of 21% in attendees and a 44% increase in exhibitors over its inaugural event last year. The conference brought together industry experts from across Europe to discuss new technologies and trends in electronics manufacturing.
“The increased participation in 2012 reflects the high energy and growth in this region,” said Tony Hilvers, IPC vice president of industry programs. “IPC is excited to support this growth and promote networking and technical education through our conference.”
The event included half-day workshops conducted by EMS experts Bob Willis and Lars Wallin, IPC’s European representative. In addition, a two-day conference featured technical presentations on the latest research from all aspects of the electronics manufacturing supply chain. The keynote address “Reliability of Lead-Free Solder Interconnection for Electronics Assembly,” was delivered by Dr. Hao Yu, senior specialist, IC Packaging and Interconnection Reliability, Mobile Phones, Nokia GmbH.
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