Dow Corning is expanding its thermally conductive product line with three dispensable materials. Developed to remove and dissipate heat away from electronic parts, the 3-6751/3-6752 thermally conductive adhesives, and 3-6621 thermally conductive elastomer can be used for various applications, including bonding and gap fill. The formulations 3-6751 and 3-6752 are heat-curable adhesives. Typical use includes bonding hybrid circuits and power components to heat sinks as well as other applications where thermal conductivity are concerns. The 3-6751 is a two-part, low-viscosity, non-corrosive formulation that cures with no by-product. Designed to offer lower modulus than typical silicone adhesives, it is suitable for applications where stress minimization and adhesion are important. lt also can be used in potting and encapsulation processes to maintain good interfacial contacts.
Share:
