The solder-ball mounter (SBM) series) from Shibuya (European representant Macrotron Process Technologies) is comprised of manual and automated systems for both substrate and wafer-level applications, as well as complete in-line solutions. Using a pin-transfer technique, the direct ball-attach technology features a precise flux deposition independent of the substrate shape. An adjustable squeegee guarantees the transfer of a precisely defined amount of flux. This eliminates the risk of damaging the balls floating on top of the vacu-um head. For example, the model SBM 350 is for BGA and SBM 360 for wafer applications, whereas solder balls with 200 to 1000µm in diameter can be placed within a tolerance of ±50µm. The processing of substrates or wafers is fully automatic. Input and output stages are equipped with magazine auto loader/unloader. The ball-attach process is controlled by a vision system. The process includes alignment of the substrate/wafer, dep-osition of the flux, followed by ball attach and its final verification. With a through-put of up to 450 substrates or 30 wafers per hour, the systems are suited for high-throughput requirements.
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