The reflow oven LPKF ZelFlow RO4 is designed for lab, prototyping and small-batch production, and offers two-zone quartz-convection for board assemblies up to 380 x 350mm. Preheating and reflow temperature and soldering time, as well as cooling fan speed and time are programmable and can be stored in one of 100 programs. Parameters simply are saved for later recall. With an inert gas (nitrogen) option, soldering can be done with high temperatures (up to 270°C for lead-free process) avoiding oxidation. Soldering can be observed through a window and parameters can be modified during the process. This approach allows even easier programming achieving better results already with first board in a batch.
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