Koki has introduced 24 lead-free pastes, having been developed over two years by a collaboration of Japanese solder manufacturers and users. The range features a variety of alloy compositions, being supplied from the Copenhagen plant. It includes a choice of alloys based on tin/silver, tin/silver/copper, Castin, and tin/zinc/bismuth to provide a variety of melting points and easy optimization to the higher and extended thermal profiles. Each paste can be delivered in an assortment of no-clean mediums, including halide-free, high activation, RMA equivalent and high-speed printing option. All mediums can work in both nitrogen and air reflow, with high-definition printing down to 0.4mm. A choice of fluxes for wave soldering is available, with a low-VOC version to reduce organic volatiles.
Share:
