Advanced packages such as CSP or others can be placed and soldered with the Auto-Vision placer of the Martin company. This kind of rework has now been considerably improved by innovative solder vacuum nozzles. With this, even microCSPs featuring tiny dimensions of 0.7 x 1.0mm can be removed and resoldered. The special cone shape of the nozzle allows a reduction of the hot-air speed and ensures a constant temperature distribution in the respective board area. This helps to protect boards and components, so that damage to pads is securely avoided.
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