Cookson Electronics Assembly Materials has signed agreements with patent holders of lead-free alloys which, combined with Alpha solders, means that the company can offer a comprehensive range of materials. An agreement with Iowa State University Research Foundation (ISURF) covering its SnAgCu U.S. patent gives Cookson access to all of the most significant lead-free solder technologies. These include Senju’s SnAgCu patent in Japan, Oatey’s SnAgBiCu Safeflo alloy and the AIM SnAgCuSb Castin. These alloys will complement the existing Alpha range of lead-free materials. With this, the company is able to provide a broad array of lead-free solders as the trend towards these processes is gaining momentum. Additionally, as the master licensee for the Oatey alloy, Cookson has the exclusive right to sublicense that technology to other solder manufacturers for electronics applications. David Zerfoss, division president and CEO: ”We remain committed to providing our customers with the lead-free alternatives that will enable them to comply with their demanding local environmental requirements, while allowing them to achieve their throughput and profitability goals.” Based on its worldwide presence, the company is reportedly a premier supplier of electronics soldering material.
Share:
