Modular platform for more user benefits

The performance data of the Siplace HF makes it the ideal partner to any existing placement line. It updates present configurations to state-of-the-art levels and is at the same time fully compatible with existing Siplace equipment. It can also be used as a universal placement system for smaller batch sizes and in prototyping, resulting not only in low placement costs but also in maximum flexibility and placement quality.

Two carbon fiber composite (CFC) gantries are mounted on a torsionally rigid and vibration-damped cast steel frame that substantially reduces noise. The advantages of the CFC gantries are that they have only one fifth of the weight of steel structures, but are twice as rigid. The thermal expansion coefficient of carbon is significantly less than that of metal, and this robust but light design guarantees extremely high accuracy and reliability. Coupled with the linear drives on the XY axes, a placement accuracy of up to 30µm/4-sigma is achievable at a real placement rate of up to 13,500 components per hour (cph).

Two placement heads on two gantries can process components independently of each other. The heads on the gantries can be reconfigured as required based on the modular design. The new twinhead works on the pick&place method and is especially suitable for high-speed and precise placement of sophisticated components in fine-pitch and ultra-fine-pitch grids as well as for handling particularly large components. The twinhead takes components up from two pick&place modules to achieve increased throughput rates. The components are optically centered as they are brought to their placement positions. The maximum stroke of the Z-axis is 60mm, enabling even components over 25mm in height to be handled. Two vision systems are available, one for fine-pitch components and non-standard components (placement accuracy ±35µm/4-sigma), the other for flip-chip components (accuracy ±30µm/4-sigma).

The high-speed placement of standard SMDs is carried out with two different collect&place revolver heads, with either six or twelve component nozzles. The cycle time is the same for all components irrespective of their size or dimensions. The Z-axis works in the sensor stop-mode and compensates for height differences both when collecting components and placing them on the PCB. To further enhance placement reliability, an additional component sensor on the head is able to check both the presence of a component on the nozzle as well as the edge ratio (size). In addition to the standard vision system (XY tolerance ±60µm/4-sigma), there is also a DCA vision module for revolver heads with a tolerance of ±55µm at 4-sigma. Bare dies or FC packages ranging in size from 0.6mm x 0.3mm up to 13 x 13mm are handled with accuracy at high speed. The various head combinations allow for the following placement rates: 12-segment collect& place plus twinhead 17,000cph; 6-segment collect& place plus twinhead 12,500cph; two twinheads 7,000cph.

The stationary camera system for components has a field of view of 52.5 x 42.5mm and a lighting unit with four freely adjustable lighting levels. Angles of 0° and 90° have now been added to the previous angles of 30° and 60°. The 0°-angle is especially suitable for connectors, CCGA and the like. This prevents shadows from impairing the recognition and inspection processes when light comes from the front. The 90°-level has been specially developed for ball-grid arrays which can thus be illuminated, measured and inspected appropriately.

The conveyor system ensures optimum transport of the PCBs through the machine. The laser-light barrier control-system stops the PCBs without physical contact. The Siplace HF can easily be operated with single and double transport in the same machine. Either the left or the right rail can be defined as fixed. The transport system can be configured to handle various PCB sizes: single transport up to 508 x 450mm, double transport for 250 x 450mm and double transport in single mode for 450 x 450mm. The overlength PCB function allows for boards of up to 610mm in length to be handled, the smallest size is 50 x 50mm.

The components are fed via four feeder tables and carriages with tape reel holders and waste bins. The new changeover tables ensure easy docking of the component carriages and when the tables are inserted, the conveyor positions are automatically aligned and all connections are made to the placement machine. This eliminates having to handle any cable connections. Two of the changeover tables can be replaced by matrix tray changers (MTC). There are 15 conveyor locations available at each of the four feeder tables around the machine (a maximum of 180 tracks/8mm width down to 16 tracks of 88mm). A wide range of deliveries can be handled, for example, rods, tapes, surftape (8, 12, 16mm) and bulk components. Customized solutions are also possible. The new MTC features two towers which enable one side to be replenished while the other continues placing without interruption. The maximum tray size is 340 x 270mm, the maximum tray height, including the component, is 30mm. The two towers provide a total capacity of 100 trays in the JEDEC standard.

The new Compact line consists of the Siplace CF multipurpose placement machine and the fast Siplace CS machine. Based on the modular concept, both models can be equipped with the same feeders, changeover tables and other identical accessories. The flexible C machine is capable of handling a multitude of different types of components, PCBs and materials. The fast Siplace CS is achieving a placement rate of 20,000cph at an accuracy of 68µm, and the more flexible Siplace CF multipurpose model is reaching a rate of 9,000cph. Depending on the type of placement head fitted the machine is capable of achieving 68µm with the collect&place and 38µm with the pick&place head. Both automatic machines fit seamlessly into the Siplace machine concept, using the principle of moving placement heads and a motionless PCB with stationary component feeding.

The Siplace CS, the solution for the variable speed sector, is a double-gantry version. A compact placement head with six segments is mounted on each of the two gantries. Both heads work on the collect&place principle. While one head loads components, the other is placing and vice versa. This way, the Siplace CS reaches a placement rate of 20,000cph.

The other compact model, the Siplace CF, is a single-gantry version, where a fine-pitch pick& place as well as a collect&place head can be mounted on. This combination achieves high speed and precision. Siplace CF covers the entire SMD range, and places not only standard components but also 0201s, chip-scale packages, µBGAs and BGAs. The customized range of nozzles and grippers enables all types of odd-form parts to be handled, ensuring a placement accuracy of 38µm/3-sigma.

With this C series, the company is meeting the demands of manufacturers who have to deal increasingly with constantly changing batch sizes and frequent product changeovers. They are being assisted in this respect by the Siplace C Pro Windows-based programming system that has been specifically adapted. It quickly creates and loads placement programs with the user offline. The PCB is shown graphically (what-you-see-is-what-you-get) and users are able to check the placement program during work. At the same time, the placement machine can be configured for each order in a short space of time with the help of the automatic transport width adjustment, the automatic nozzle changer or by changing feeder modules.

The investment protection for the Siplace platform also applies to the C series. Based on many years of experience and knowledge of SMD placement technology, the supplier is offering with these placement machines cost-effective, innovative and tested quality. The modular concept ensures easy and quick adaptation to growing production demands. Gerhard B. Wolski

Mit eine der drängensten Fragen derzeit im Umfeld der Elektronikfertigung lautet: Wann geht es endlich global wieder aufwärts?. Die Vorstellung von zwei neuen Siplace-Bestückmaschinenserien kann als eine mögliche Antwort gesehen werden: nämlich jetzt. Gäbe es keinen Markt, wären diese SMD-Bestücker auch nicht entwickelt worden. Die Siplace HF ist ein äußerst flexibles System, das praktisch alles Erdenkliche auf Baugruppen setzen kann. Die C-Serie zeichnet sich durch kompakte Stellfläche und die Mid-Range-Positionierung aus.

L’une des questions cruciales dans le domaine de la fabrication électronique actuelle est de savoir quand la situation mondiale va enfin s’améliorer. La présentation de deux nouvelles machines à implanter les composants Siplace peut être considérée comme une réponse possible : à savoir maintenant. Ces machines pour composants SMD n’auraient en effet pas été développées s’il n’existait une demande correspondante. La Siplace HF est un système d’une grande souplesse, capable d’implanter pratiquement n’importe quoi sur des cartes. La série C se distingue par sa compacité et son positionnement Mid-Range.

Una delle questioni più insistenti nel contesto della produzione di componenti elettronici è: quando finalmente può di nuovo iniziare la ripresa globale? L’immaginazione di due nuove serie di macchine per connessioni può essere interpretata come una possibile risposta: cioè adesso. Se non esistesse alcun mercato, allora non sarebbero stati neanche sviluppati questi sistemi di connessione SMD. La Siplace HF è un sistema particolarmente flessibile, praticamente capace di applicare tutto il pensabile sui gruppi costruttivi. La serie C è caratterizzata da una superficie d’appoggio compatta e dal posizionamento Mid-Range.