Robotic dispensing reportedly provides flexibility for electronics production that is not possible from the stencil-printing process. As well as the application of solder paste and surface-mount adhesive, dispensing systems are utilized with technologies such as the application of conductive adhesives, chip-on-board glob tops and flip-chip underfills. The National Physical Laboratory has launched a dispensing code of practice. This gives practical guidance for dispensing the in production of board assemblies. Issues such as programming, heating requirements, achieving the desired dot or line shape, and tips on paste and adhesive placement are included. Available at £50 online at
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