X-Tek’s Linx benchtop system is regarded a breakthrough in cost-effective real-time X-ray inspection. High resolution and real-time microfocus imaging meets a broad range of electronics applications such as BGA, µBGA and flip-chip inspection. The Linx also offers reliability and ease-of-use. In particular, the superior imaging capabilities make it ideal for spotting defects such as solder ball wetting, ball-to-pad delaminations, cracked joints in flipped packages and lifted bond wires. Easy to operate, with only minimal training required, the instrument features a 100kV open tube source for ultra-high resolution down to at least 2µm. Compact and maneuverable, the Linx is able to take 16×16-in boards for batch inspection, with a 100% scan area. The direct-to-monitor viewing provides instant fault analysis with a magnification of up to 200x. The anti-collision manipulator can tilt on X, Y and Z-axes, while the adjustable image intensifier and source enable oblique angle views. Linx features a safety-interlock system and conforms to all international radiation guidelines.
Share:
