Towa’s Aqua Eco (in Europe represented by Macrotron Process Technologies) is clamed to be the first molding system with a compound utilization rate of up to 100%. Because of this high productivity the manufacturing costs are reduced, and the automated system satisfies the standards of environment friendliness due to the fact that it uses water pressure to drive a direct-transfer molding press. Current molding procedures reach a 50% utilization of compound. The direct-transfer method eliminates the common culls and runners, and increases the utilization rate. In addition to the reduction of energy and material consumption, the waste by-products are minimized. The system supports single-cavity molding of large substrate BGA-CSP (ball-grid array chip-scale packages), MAP-BGA (mold-array process BGA) and even wafer-level packaging. The direct-transfer molding eliminates downtime otherwise caused by manual conversion. The precision of the mold-close clamp positioning has been improved by factor five, thus enabling the production and packaging of ultra-thin chips.
Semicon Europe Hall A1 booth #100
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