Characteristics of the high-speed die sorter Mühlbauer DS 6000 are flexibility, speed, low cost of ownership and the reportedly high inspection quality. The system offers advantages in small die handling down to 0.7 x 0.7mm and less. Custom-specific solutions for high-volume production can be realized, so, for example, for wafer and component suppliers, chip-on-board assemblers using multi-chip application and packaging-service companies. The machine, configured for tape and reel handling, picks the components directly from the wafer and after inspection sorts them into carrier tape or surf tape. The sorter allows chip-tray handling and placement of dies in waffle or gel pack, achieving a throughput of up to 6,000 chips/hour with flip option and up to 8,500 without. By using the flip-chip unit, bumped dies are picked from wafers and conveyed to tapes. The vision system inspects surfaces and wafer bumps as well as die backside (laser marks). Three optical units referring to bond, flip and place positions ensure high accuracy. Wafer mapping delivers statistics on good and bad dies as well as on machine cycle times. The DS 6000 is equipped with hot or cold sealing stations.
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