IPC of the U.S. and Hong Kong Printed Circuit Association (HKPCA) have plans to co-produce the International Printed Circuit and Electronics Assembly Fair on September 17 to 19, 2003, at the Guangzhou International Convention Center in China. The event will serve both the printed circuit board (PCB) and electronics assembly industries. HKPCA, which shaped an exhibition in Dongguan, and IPC will draw from their proven experience in trade show development to create a cost-effective and focused event which has already gained support of the U.S. and Chinese governments. ”The timing is right for an event of this magnitude and the location is prime”, IPC executive Plzak explained. ”Overnight, it seems, China has become a global heavyweight producer and consumer of products and services. This fair will create a venue for exhibitors to better reach the fastest growing electronics market in the world.” As HKPCA executive Tom Tang underlines, ”The fair is an example of how two organizations, although thousands of miles apart, can work together to benefit the industry”.
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