The Indium Corporation’s VP of technology, Ning Cheng Lee, is the author of the book Reflow Soldering Processes and Troubleshooting – SMT, BGA, CSP and Flip Chip Technologies. Skillfully written and up-to-date, the book is based on many years´ experience in soldering and process development. Dr. Lee’s book examines all aspects of troubleshooting reflow soldering involving advanced component technologies, materials, alloys and fluxes, application methods, processing recipes and many more. With this, it supports the achievement of higher throughputs, wider process windows, higher overall yields and fewer soldering defects.
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