The International Electronics Manufacturing Initiative (iNEMI), an industry-led consortium focused on identifying and closing technology gaps, has announced the publication of “Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing”. The book, published by Wiley-IEEE Press, is based on the results of iNEMI’s more than six-year study into lead-free electronics, and it provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly.
“The iNEMI book is the first practical, primary reference to cover lead-free solder assembly as well as the analysis and reasoning behind the selection of tin-silver-copper as the recommended lead-free solder,” said Jim McElroy, iNEMI CEO. “Data from several large reliability studies, including rework on standard and large boards, demonstrated the manufacturability of the recommended solder. This book is a ‚must read‘ for assembly professionals.” The book features chapters by some of the industry’s leading experts on Pb-free processing and covers such topics as solder material properties, reliability testing, lead-free rework, tin whisker mitigation strategies and more. This book is the result of the commitment and dedication of many iNEMI members,” said McElroy. “It represents contributions from several hundred researchers at more than 100 companies, universities and government agencies. Through collaborative projects, iNEMI members were able to benefit from the combined efforts of many industry experts working together for the common good, thus minimizing the investment of any particular company. This book makes the information they compiled available to the electronics industry at large.”
EPP Europe 419
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