Datacon, supplier of semiconductor manufacturing equipment, will have a US subsidiary up and running with offices in Trevose/Philadelphia and in Phoenix. Its existing Asia Ltd. in Singapore is also currently undergoing expansion, and will soon be responsible for marketing, sales and technical support in this region. Sales offices in the Philippines, Korea, China and Taiwan will be added, while in Japan collaboration with a representative is in focus.
The Austrian company is responding to the increasing demand for complex, customized packaging solutions and will thus be able to guarantee the shortest communication channels to its customers. Datacon’s strategic orientation – from equipment supplier through to provider of complete process solutions in the field of die bonding – combined with the growing complexity of production processes and the ever-decreasing product cycles of the packages demands an intensive, direct exchange of information between the manufacturer’s design departments and those of its customers. The company believes that it has to respond quickly to individual requirements with fully customized process and automation solutions. As Helmut Rutterschmidt, president and director of the board at Datacon, underlines, „Although our sales partner Kulicke & Soffa has done a fantastic job in the last three years, with our recent rapid growth we have now reached a size which not only allows us to operate independently worldwide, but also makes this a necessity if we are to utilize our dynamic strength and flexibility to the advantage of our customers.“
The close collaborative partnership with the existing sales partner will be maintained in the form of a marketing alliance. This is reflected in the fact that both a large number of the Datacon product specialists and the experienced management of the die-bonder division at Kulicke & Soffa will transfer to Datacon’s subsidiaries in the US and Asia. These enlargements together with the acquisition of Eurotec GmbH, and the founding of a Hungarian subsidiary are regarded as an excellent starting point for becoming a leading supplier in the advanced packaging market focusing on die bonding.
With four product divisions and a staff of 400, the group will serve the different market segments with their individual needs. Rutterschmidt seems confident in the upcoming progress of the enterprise, „We have taken on a lot. But we are well positioned and have laid all the foundations for optimum support of our customers, also in the future – in all aspects of advanced packaging, around the globe“. And his customers seem to be honoring this. Despite the undeniable slump in the industry, the company had the opportunity to negotiate some attractive orders with remarkable potential, placed in the prospective areas of telecom and automotive. (gbw)
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