LPKF of Garbsen, Germany, has concluded a number of forward-looking licensing and cooperation agreements to broaden its base in laser structuring and miniaturized packaging solutions. Most prominently featured was the licensing partnership with Ticona, which brings together LPKF’s LDS (laser direct structuring) process technology and Ticona’s Vectra LCP E 820i polymer material fro producing 3D injection molded circuit carriers.
The second agreement initiates a technology cooperation with Germany-based connector and sub-system manufacturer Harting. This partnership lets Harting develop and produce 3D-MIDs (molded interconnect device) micro-packaging using LPKF’s laser structuring process. For LPKF, this is a promising venue of further promoting its LDS method. The material used for such MIDs produced by Harting will be Ticona’s Vectra LCP. LPKF and Harting are planning to develop and qualify the process for mass production, which is to take place in-house, at Harting. Thirdly, LPKF has established LaserMicronics as its service provider for micro-material processing. “The range of services offered by the LPKF Laser Center has been well received,“ says Marc Hüske of LaserMicronics, “proving, a year after starting, that it makes sense to become independent.“ Together with Elaser, LaserMicronics offers high-quality laser micro-processing to customers in various advanced industries. WS
EPP EUROPE 400
Share:
