Semiconductor-packaging
New Managing Director
1. September 2022Palomar Technologies, a global supplier of total process solutions for advanced photonics and microelectronic device packaging, has appointed Mr. Thorsten
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10 Meldungen
Palomar Technologies, a global supplier of total process solutions for advanced photonics and microelectronic device packaging, has appointed Mr. Thorsten
Palomar Technologies announced the availability of their new Palomar 3880-II Die Bonder.
Palomar Technologies has announced that its European branch has aligned with Optocap to provide European-based process-development and manufacturing
Palomar Technologies has announced that its European branch, Palomar Technologies GmbH, has aligned with Optocap to provide European-based Process
David Mudd has been appointed Sales and Marketing Manager for Palomar Technologies. Most recently, he was Applications Engineering Manager and based at
Palomar Technologies’ Model 8000 is a gold ball-and-stitch thermosonic wire bonder for complex, precision gold wire bonding applications where
Bruce W. Hueners has been named President of Palomar Technologies. Mr. Hueners joined Palomar Technologies in 1981. He was instrumental in elevating
Palomar Technologies' Fast T6 is a 6-axis optical alignment system for test and production applications on optical component, fiber or fiber arrays to a
Palomar Technologies' model 6500 high-accuracy eutectic die-bonder provides a placement accuracy of <1.5 micron/3-sigma and a cycle time of less than 7
Palomar Technologies has joined a strategic alliance to provide photonic component manufacturers with a single-source for automated assembly, test and