Palomar Technologies’ model 6500 high-accuracy eutectic die-bonder provides a placement accuracy of <1.5 micron/3-sigma and a cycle time of less than 7 sec. per placement. The bonder can automate assembly for advanced applications, such as P-side down laser diode attachment, silicon bench (V-groove) placement, high-density RF power transistors and ultra-fine pitch hybrids. The machine has a footprint of less than 1sqm, is just 38-in (97 cm) wide, 48-in (122 cm) long, and has a height of 70-in (1.78 m). The large bond area is 12 x 6-in (300 x 150 mm). XY-encoder resolution is 0.1 micron. The system has six smart programmable pick tools on a bi-directional rotating tool turret, which can be changed “on the fly“. The 6500 can be customized for any type of presentation media such as automated waffle-pack loader, tape-and-reel feeder, or automated gel-pack loader. Other options include auto-feed mechanism and in-line SMEMA conveyors, or flip-chip die bonding. The die bonder has programmable pulse heating eutectic stages for precise ramp-up and cool-down. Ramp times and repeatability are >100 K/sec (±2K). Advanced packaging technologies for optoelectronic, wireless, and MEMS devices require exact placement of extremely small and fragile components, for which this equipment has been designed.
EPP EUROPE 459
