Products
Automatic Wedge Bonder with Triple-Head
6. September 2010Orthodyne Electronics announces the shipment of the first Triple-Head 7600HD Automatic Wedge Bonder system to a major power semiconductor OEM. Siegbert
Alle Meldungen, Produkte und Entwicklungen rund um Orthodyne Electronics.
3 Meldungen
Orthodyne Electronics announces the shipment of the first Triple-Head 7600HD Automatic Wedge Bonder system to a major power semiconductor OEM. Siegbert
Orthodyne Electronics’ new high density series wire bonders are designed to address the demand for smaller, thinner and denser discrete power
Orthodyne Electronics has earned the number 1 rating in the VLSI Research Inc 2007 10 BEST Awards for Assembly Equipment & Focused Suppliers of Chip