The Automatic Wedge Bonder’s modular and flexible design can be configured in one to four head configurations depending on the line balancing requirements. The system can be easily reconfigured in the field, offering opportunities to rearrange production lines as product mix changes. For added flexibility, each bondhead can accommodate large wire, small wire or PowerRibbon.
Provider of reflow soldering technology, Vitronics Soltec has launched new Heavy Board options for its Centurion 1240 reflow soldering system. This
Test Research, Inc. (TRI) has announced the launch of its new 3D AXI TR7600FB SII system and emphasized that it has been designed to deliver clearer
Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025 at booth #2905 to show latest test and