ERS electronic

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ERS electronic launches fully automated 310×310 mm panel-level packaging system

Foto: Jonathan Castañeda / Unsplash

Semiconductor-packaging

ERS electronic launches fully automated 310×310 mm panel-level packaging system

6. Oktober 2026

ERS electronic has unveiled a fully automated panel-level packaging system for 310×310 mm substrates, consolidating three thermally critical process steps into one platform. The system targets advanced packaging…

Semiconductor-packaging

ERS is giving a first look at the next-generation ADM330

8. April 2022

ERS electronic reveals the details of its third-generation flagship thermal debond machine, ADM330. The machine was introduced to the market in 2007 as

Global competence center for advanced wafer level packaging

Foto: Bermix Studio / Unsplash

News

Global competence center for advanced wafer level packaging

15. April 2011

ERS electronic GmbH announced to open a new competence center by the end of March at its headquarters near Munich, Germany. There, global customers in the