ERS electronic, based in Barbing, Germany, has announced a fully automated panel-level packaging (PLP) system for 310×310 mm substrates that integrates temporary carrier bonding, debonding and detaping within a single platform. The machine operates at 13 panels per hour, eliminating inter-tool substrate transfers across the three process steps. A first unit has already been delivered to a leading semiconductor manufacturer for integration into its panel production line.
The 310×310 mm panel format offers improved substrate area utilisation compared to standard 300 mm circular wafers, and Yole Group projects the PLP segment to grow at a CAGR exceeding 40% over the next five years. ERS positions the system for dual-carrier bonding and debonding workflows increasingly required in backside processing for 3D IC, HBM and 2.5D IC architectures, where consolidating steps within one platform reduces handling risk and fab floor complexity.
ERS electronic has been active in panel-level packaging since shipping its first commercial panel-level tool to Fraunhofer IZM Berlin in 2018. The new system is developed and manufactured at the company's Advanced Packaging facility in Barbing, drawing on ERS's 55 years of thermal management expertise and a semiconductor equipment engineering team integrated in 2024.
Quelle: SEMICON Europa – https://www.semi.org/en/node/175881
