
Pb-free, no clean solder paste for automotive electronic applications
12. Dezember 2008Cookson Electronics Assembly Materials has recently launched its new automotive Pb free paste, developed primarily for “Under the Hood” applications.
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Cookson Electronics Assembly Materials has recently launched its new automotive Pb free paste, developed primarily for “Under the Hood” applications.

Cookson Electronics Assembly Materials (CEAM) have recently hosted an informative Automotive Electronics Technology Day attended by 50 engineers and

Alpha WS-819 water-soluble, lead-free solder paste from Cookson Electronics Assembly Materials delivers very good printing characteristics over a wide

Cookson Electronics Assembly Materials has announced the launch of its Alpha OM-338 PT lead-free no-clean solder paste. This new product is said to offer

Cookson Electronics Assembly Materials’ favored Alpha Vaculoy SACX 0307 lead-free paste is reportedly outperforming SnCuNi alloys, and offers soldering

Cookson Electronics Assembly Materials has signed agreements with patent holders of lead-free alloys which, combined with Alpha solders, means that the