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    Pb-free, no clean solder paste for automotive electronic applications
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    Products

    Pb-free, no clean solder paste for automotive electronic applications

    Cookson Electronics Assembly Materials has recently launched its new automotive Pb free paste, developed primarily for “Under the Hood” applications.
    Veröffentlicht
    12. Dezember 2008
    Lesezeit
    1 Minute
    Rubrik
    Products

    In Consortium sponsored studies, where assemblies were subjected to extreme thermal cycling under vibration, solder joints made with Alpha OM-350 with InnoLot alloy, showed improved resistance to mechanical failure versus SAC 387. “We are responding to the automotive industry need to increase electronic system reliability while decreasing the weight and complexity of wiring harnesses,” said Cookson Electronics’ Global Product Manager, Mitch Holtzer.

    Alpha OM-350 with InnoLot Alloy shows improved performance over SAC 387 based lead free solder, which can be important in applications like engine-mounted control modules where extreme temperature variations and vibration are commonplace.”

    InnoLot Alloy is a patented, 6 part alloy with a reduced melting point versus SAC 305, and is already being tested at a number of the large automotive electronic producers around the globe.

    www.cooksonelectronics.com

    EPP Europe 535

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