The lead-free no-clean solder paste is designed for electronics manufacturers who are currently dissatisfied with their lead-free paste selection, or who have yet to make a decision as the RoHS compliance deadline of July 1, 2006 approaches.
In addition to excellent pin testability with virtually no residue on pins, it offers high print speeds (up to 150 mm/second, on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and excellent low voiding and anti-slumping characteristics.
EPP EUROPE 420
