LPKF’s MicroLine UV laser systems allow for a wide variety of precision PCB production tasks. These versatile systems are ideal for accurately cutting flex-circuits, depanelization of rigid PCBs, drilling microvias and removing covering layers. With a cutting width of 20 to 40µm (0.8 to 1.6mil), the systems produce clean-cut edges with sharp sidewalls and minimum thermal distortion. The lasers can cut any This technique is superior because the UV laser systems automatically compensate for positional or material distortion, such as from lamination. The equipment can remove layers of all kinds as well as solder masks, for example, to leave a residue-free copper surface over a minimum 50µm area. The laser can also create openings in solder resist with diameters as small as 30µm. Microvia drilling is another area, to generate hole geometries of less than 200µm in complex high-density interconnect (HDI) circuits.
EPP EUROPE 437
