News
Expanded partnership to support laser plastic welding
27. Mai 2025Altus Group and sister company Danutek are expanding their technology offering through an enhanced partnership with LPKF. The companies aim to support the
Alle Meldungen, Produkte und Entwicklungen rund um LPKF.
32 Meldungen
Altus Group and sister company Danutek are expanding their technology offering through an enhanced partnership with LPKF. The companies aim to support the
Altus Group, a leading distributor of capital equipment, says it has been introducing provider of laser manufacturing solutions LPKF’s laser depaneling
Altus has announced a new partnership with laser specialist company, LPKF for the distribution of laser-based solutions.
With the higher demands on quality of solder paste stencils and cutting elements, LPKF examined quality features using the StencilLasers as examples.
LPKF Laser & Electronics AG is setting new standards with its easy-to-use, chemical-free laboratory processes for PCB prototyping. Now the Garbsen,
The laser specialist LPKF has developed a process for generating local recesses and bumps in stainless steel stencils for solder paste printing with the
„Nearly 20 percent of LPKF’s workforce is engaged in research and development. This ensures our technological leadership and expands our product
LPKF has boosted turnover in the first nine months of the ongoing financial year to 61 million Euro. This corresponds to a rise of 76 % compared to the
Good news for the LDS technology: the engineers and technicians have further optimized the top model for laser direct structuring, the LPKF Fusion3D. With
Designed for 24/7 operation, the LPKF Fusion3D is fully equipped for the laser-structuring of molded interconnect devices (MID). The laser system
Dipl.-Ing. Bernd Lange, Member of the Board, LPKF: A wide variety of international people visited our booth. A third of which were from European
The multilayer production tools from LPKF help to produce complete multilayer prototypes in three simple steps. Structuring, pressing and through-hole
LPKF introduces its MultiCut laser cutting system designed especially for SMT stencil work. The MultiCut features FastCut technology, a specially designed
LPKF announces the newest version of the MicroLine 350D, a compact, versatile laser system designed especially for cutting and drilling flex circuits,
LPKF has announced its ProtoLaser 200, a versatile state-of-the-art laser system, combining advanced laser technology, optics and table mechanisms,
The LPKF Protolaser 100 system is specifically designed for the in-house production of high quality RF and microwave boards. This Protolaser uses a
LPKF Laser & Electronics introduced its MicroLine C-series laser system for cutting and depaneling board assemblies as well as PCB panels at high
The LPKF MicroCut high-speed stencil laser cuts any shape at up to 50,000 apertures per hour, making it suitable for high-end wafer-bumping stencil
The LPKF ProtoMat S62 PCB plotter is a compact, afforadable and automated system that delivers more than double the milling speed of comparable machines
The LPKF LaserScalpel is obviously the first laser-based PCB rework tool that removes copper bridges from boards with very fine structures. The scalpel
As the top-of-the-range model of the LPKF board-plotter family, the ProtoMat H100 sets the standards for PCB prototyping and small series production. The
The LPKF ScanCheck MicroView is a fast inspection system for wafer-print stencils with a high, interpolated resolution of 24,000dpi. Stencils used for
LPKF's MicroLine UV laser systems allow for a wide variety of precision PCB production tasks. These versatile systems are ideal for accurately cutting
The LPKF ProtoPlace semi-automated entry pick&place system has been designed with the principles of ergonomic requirements, offering fine-adjustable
LPKF has introduced a system for cutting wafer print stencils which operates with a speed of up to 50,000 cutouts per hour. The very small apertures can
LPKF of Garbsen, Germany, has concluded a number of forward-looking licensing and cooperation agreements to broaden its base in laser structuring and
Degussa and LPKF have closed an agreement for the use of a special plastic additive, and the marketing of molding compounds. The additive enables tracks
Through a licensing agreement, LPKF and Ticona combine the laser-structurable plastic material Vectra LCP E 820i with laser direct structuring (LDS)
LPKF's MicroLine Drill 600 allows small and medium-sized PCB manufacturers to meet the growing demand for high-density interconnect (HDI) PCBs with
The introduction of a special LPKF plastic material allows for the first time the production of 3D injection-molded circuit carriers as reflow-capable