Alpha Assembly Solutions, producer of electronic soldering and bonding materials, has recently introduced Alpha OM-358, a zero-halogen, lead-free solder paste designed to provide ultra-low voiding performance on all component types, including bottom terminated components.
“Alpha OM-358 was designed to enhance process benefits through best-in-class voiding performance”, said Paul Salerno, Global Portfolio Manager for SMT Assembly for the company, a part of the MacDermid Performance Solutions Group of Businesses. “When using a high soak profile, it produces an average voiding of below 10%, with consistent control of void distribution for increased process stability, elimination of rework, and enhanced electrical and thermal performance of a customer’s end product”.
The lead-free solder paste exhibits excellent resistance to electrochemical migration on fine pitch components which makes it ideal for high reliability applications such as automotive (powertrain, in-cabin electronics & sensors), LED, medical and defense.
