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5 Meldungen
Alpha Assembly realeased its low temperature solder paste for temperature sensitive substrates and components as well as board and component warpage.
Alpha Assembly has introduced their PowerBond solder preforms for high temperature, high reliability, lead-free interconnects.
Alpha Assembly has introduced Alpha OM-358, a zero-halogen, lead-free solder paste designed to provide ultra-low voiding performance on all component types.
Alpha Assembly introduced the OM-550 solder paste, a low temp. chemistry paired with the HRL1 alloy for assemblies with temperature sensitive Substrates.
Alpha Assembly introduced the TrueHeight Preforms that is engineered with embedded spacer technology and addresses the bondline thickness requirement.