Zum Inhalt springen
EPP Europe
  • News
  • Products
  • Applications
  • Technology
  • Semiconductor
  • Inspection
  • Company News
  • Events
EPP Europe
  • Technology
  • Inspection (AOI/AXI)
  • Semiconductor Packaging
  • Company News
  • Products
  • Trade Shows & Events
    EPP Europe Newsletter
    The most important electronics-manufacturing news delivered to your inbox.

    Info

    • Impressum
    • Datenschutz
    • Barrierefreiheit
    • Datenschutzeinstellungen

    Kontakt zur Redaktion

    EPP EuropeKonradin Mediengruppe
    Ernst-Mey-Str. 8, 70771 Leinfelden-Echterdingen

    E-Mail: redaktion@konradin.de
    Folgen Sie uns
    EPP Europe
    © 2026 EPP Europe
    Startseite/Top-news/Artikel
    Surface mount technology equipment communication protocol
    Foto: Nicolas Thomas / Unsplash
    Top-news

    Surface mount technology equipment communication protocol

    Enterprises who manufacture surface mount technology equipment launched the SMT equipment communication protocol standardization subcommittee.
    Veröffentlicht
    01. Dezember 2017
    Lesezeit
    1 Minute
    Rubrik
    Top-news

    At the Japan Robot Association, enterprises who manufacture surface mount technology (SMT) equipment and related software, launched the SMT equipment communication protocol standardization subcommittee in order to establish protocols for sharing information by communication methods between SMT machines (M2M cooperation).

    A ballot was held, and the elected subcommittee chairman for the first year is from Fuji Machine Manufacturing Co., Ltd. and the vice subcommittee chairman is from Panasonic Corporation, with the board of governors comprising representatives from member corporations including Yamaha Motor Co., Ltd., Juki Corporation, along with Omron Corporation, Saki Corporation, Tamura Corporation, and CKD Corporation. Twenty member companies will work together to advance this standardization.

    In a traditional SMT production line, there are various machines such as printers, inspection machines, placement machines, and reflow ovens, along with connecting conveyance machines. These machines typically come from different manufacturers. Since the format of printed circuit board data in each machine and communicating with other machines is unique for each company, the user is the one that must spend the time and money in order to manage information consistently for entire lines.

    Once this subcommittee has standardized protocols for communication between various machines from SMT production lines, it will be possible for users to easily implement placement systems that extend beyond the boundaries of companies. Some merits of this include: facilitating production management and hastening support for variable-volume variable-mix production. Manufacturing companies will also have opportunities to create new value offerings because of the ease of M2M cooperation.

    With this, the following companies are contributing to the development of the SMT market of the future:

    • CKD Corporation
    • Fuji Machine Manufacturing Co., Ltd.
    • JUKI Corporation
    • Koh Young Technology Inc.
    • Komatsu Electronics Co., Ltd.
    • Marantz Electronics Ltd.
    • MIRTEC JAPAN Co., Ltd.
    • Musashi Engineering Inc.
    • Mycronic Corporation
    • Nagaoka Factory Corporation
    • Nagoya Electric Works Co., Ltd.
    • OMRON Corporation
    • Panasonic Corporation
    • Parmi Co., Ltd.
    • Saki Corporation
    • Senju Metal Industry Co., Ltd.
    • TAMURA Corporation
    • Test Research, Inc.
    • Yamaha Motor Co., Ltd.
    • YS Co., Ltd.

    www.fuji-euro.de

    Mehr aus Top-news

    Weitere aktuelle Artikel aus der Rubrik Top-news.

    Alle Top-news-Artikel
    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026Foto: Indium Corporation
    Top-news

    Indium Corporation and SMT Thermal Technologies to Present Low-Temperature Reflow Energy Savings at EFX 2026

    7. Oktober 2026

    Indium Corporation and SMT Thermal Discoveries will jointly demonstrate how pairing Durafuse LT mixed-powder alloy with the SMT R320 convection reflow oven cuts energy costs and emissions by 25% compared with…

    ITW EAE Electrovert EcoWave Wins 2026 NPI AwardFoto: Bermix Studio / Unsplash
    Top-news

    ITW EAE Electrovert EcoWave Wins 2026 NPI Award

    1. Oktober 2026

    ITW EAE has received a 2026 New Product Introduction Award for the Electrovert EcoWave, an option for its wave soldering machine platform.

    Omron Promotes End-to-End Barcode Reading and Sensing for Production TraceabilityFoto: Edgar Cornejo / Unsplash
    Top-news

    Omron Promotes End-to-End Barcode Reading and Sensing for Production Traceability

    8. September 2026

    Omron Inspection outlines an end-to-end barcode reading and sensing approach designed to provide full visibility across electronics production processes, supporting traceability requirements in smart factory…

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and TraceabilityFoto: Cybord
    Top-news

    Cybord Launches Air-Gapped Visual AI Platform for On-Premises Component Inspection and Traceability

    6. September 2026

    Cybord has announced a fully air-gapped version of its Visual AI component analytics platform, enabling organisations operating restricted or closed networks to run advanced inspection and traceability capabilities…

    ← Zurück zu Top-newsZur Startseite