The Assembly division of MacDermid Alpha Electronics Solutions, a producer of electronics soldering and bonding materials, will be presenting its latest low temperature soldering solutions at the EPP InnovationsForum on Wednesday 13th March, in Böblingen, Germany.
Ralph Christ, Customer Technical Support Manager DACH Region will present on the latest trends and technologies in low temperature assembly with a focus on the revolutionary Alpha OM-550 HRL1 low temperature solder paste. ¨Moving to a low temperature soldering process can provide multiple benefits including enabling a smooth transition from wave soldering to pin-in-paste, reducing thermal stress on components, and providing significant energy savings,” comments Ralph. ¨Low Temperature assemblies also deliver a notable decrease in Non-Wet Open and Head-in-Pillow defects, as well as, dynamic warpage, common issues exacerbated by the continued trend towards miniaturization in portable device applications.”
The low temperature solder paste paired with the HRL1 alloy has been designed to increase production yield and reduce component warpage on temperature sensitive substrates, components and high warpage chips. With a minimum peak temperature of only 185 °C vs 245 °C, Alpha OM-550 reduces energy consumption in the SMT process. The low temperature reflow also eliminates HIP and NWO defects. The solder paste delivers improved mechanical reliability, drop shock performance and thermal cycling reliability in mixed alloy joints compared to other low temperature alloys.
